Method of frame plating and method of forming magnetic pole of thin-film magnetic head
AssigneeTDK Corporation
InventorAkifumi Kamijima
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AssigneeTDK Corporation
InventorAkifumi Kamijima
Estimating the term…
In the method of frame plating according to the invention, a first patterned resist layer is formed using a first resist containing a material generating an acid; the first patterned resist layer is coated with a second resist capable of entering into a crosslinking reaction in the presence of an acid; an acid is generated in the first patterned resist layer to form a crosslinked film in a portion of the second resist near the boundary that touches the first patterned resist layer; and the non-crosslinked portion of the second resist is peeled off to form a second patterned resist layer, thereby forming a frame. As the first resist, a chemically amplifying type positive material containing a base resin comprising a high molecular compound shown by a predetermined formula and having a weight average molecular weight of 10000 to 25000 and a molecular weight distribution of as narrow as 1.05 to 1.25 is used.
A method of frame plating comprising a step of forming a frame using a resist and a step of performing plating by using said frame to form a patterned plating layer,
A method of forming a magnetic pole of a thin-film magnetic head provided for forming a layer including a magnetic pole portion, the thin-film magnetic head comprising:
A method of forming a magnetic pole of a thin-film magnetic head provided for forming a layer including a magnetic pole portion, the thin-film magnetic head comprising:
Dependencies are inferred from the claim text.