Low loss dielectric materials for microwave applications
AssigneeIntematix Corporation
InventorsYi-Qun Li, Xiao-Dong Xiang, Yi Dong, Shifan Cheng, Gang Wang, Ning Wang
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AssigneeIntematix Corporation
InventorsYi-Qun Li, Xiao-Dong Xiang, Yi Dong, Shifan Cheng, Gang Wang, Ning Wang
Estimating the term…
Composition for a solid state material, in bulk and in thin film form, that provides relatively high dielectric permittivity that is tunable with variable electrical field bias, relatively low loss tangent and low leakage current for microwave applications. In a first embodiment, the material is BaySr1−yTi1−xMxO3, where M is a substance or mixture including one or more elements drawn from a group consisting of Ta, Zr, Hf, V, Nb, Al, Ga, Cr, Mo, W, Mn, Sc and Re, and the indices x and y satisfy 0≦x≦1 and 0≦y≦1. A preferred choice is M=Ta, V, W, Mo and/or Nb. In a second embodiment, the material is BaySr1−yTi1−x−zTaxMzO3, where M is a substance or mixture including one or more trivalent elements drawn from a group consisting of Al, Ga and Cr and the indices x, y and z satisfy 0≦x+z≦1 and 0≦y≦1.
A low loss material for microwave applications, having a relative dielectric coefficient ∈rel that is at least equal to 50 and is tunable with variable electrical field bias and a loss tangent no larger than 0.03, the material having a composition of BaySr1−y(Ti1−xMx)O3, where M is an element drawn from a group consisting of Ta, V, Nb, Mo, W, and the indices x and y satisfy 0.02≦x≦0.3 and 0≦y≦1.
Dependencies are inferred from the claim text.