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US 6,641,928 B2Granted
Adhesives and electric devices
AssigneeSony Chemicals Corp.
InventorsMotohide Takeichi, Misao Konishi, Junji Shinozaki, Yasushi Akutsu
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AssigneeSony Chemicals Corp.
InventorsMotohide Takeichi, Misao Konishi, Junji Shinozaki, Yasushi Akutsu
Estimating the term…
An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.
An adhesive for connecting a semiconductor chip and a wiring board, comprising a first resin component that is an epoxy which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component, and a second hardener which is addition-polymerized with the first resin component, wherein the adhesive after curing has an elastic modulus decreasing with an increase in temperature, and wherein an elastic modulus loss sharply increases at both of a first temperature of from higher than 30° C. to lower than 150° C. and a second temperature within a range of from 130° C. or more to 250° C. or less and higher than the first temperature.
An adhesive for connecting a semiconductor chip and a wiring board, comprising a first resin component that is an epoxy which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component, a second hardener which is addition-polymerized with the first resin component, and conductive particles.
An adhesive for connecting a semiconductor chip and a wiring board, comprising a first resin component that is an epoxy which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component, a second hardener which is addition-polymerized with the first resin component, and a filler of silica, alumina or titanium oxide.
An electric device comprising a semiconductor chip and a wiring board, wherein the semiconductor chip is adhesively bonded to the wiring board with an adhesive, wherein the adhesive comprises a first resin component that is an epoxy which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component, and a second hardener which is addition-polymerized with the first resin.
Dependencies are inferred from the claim text.