Photocurable pressure-sensitive adhesive composition and its sheet
AssigneeSekisui Chemical Co., Ltd.
InventorsHideaki Ishizawa, Munehiro Hatai, Masakazu Nakata, Motohiro Yagi
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AssigneeSekisui Chemical Co., Ltd.
InventorsHideaki Ishizawa, Munehiro Hatai, Masakazu Nakata, Motohiro Yagi
Estimating the term…
An objective is to provide a pressure-sensitive adhesive composition which shows pressure-sensitive adhesive properties at ordinary temperature, has the ability to cure upon irradiation and after photocure exhibits improved bond strength relative to high-polarity adherends, such as PET, PVC and metals, and improved moist heat-resisting bond strength, a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet obtained from the aforementioned pressure-sensitive adhesive composition. A photocurable pressure-sensitive adhesive composition containing a polyester resin having a glass transition temperature (Tg) of 25° C. or above, a cationically photopolymerizable compound and a cationic photoinitiator.
A photocurable pressure-sensitive adhesive composition comprising:
A photocurable pressure-sensitive adhesive composition characterized as containing a polyester resin having a glass transition temperature of 25° C. or above, a cationically photopolymerizable compound, a cationic photoinitiator and a rosin comprised chiefly of abietic acid.
A photocurable pressure-sensitive adhesive composition containing:
Dependencies are inferred from the claim text.