Method for selectively applying solder mask
OwnerAllen D. Hertzinventor
Life of this patent
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Abstract
A method is disclosed for applying solder mask to an area respective of a plurality of receiving pads on a Printed Circuit Board. The solder mask can be at least partially removed during the component removal process exposing the conductor, via and annular ring. The exposed conductor, via and annular ring can cause defects and unreliable solder joints should the solder flow along the conductor and into the via. A small stencil can be used to apply solder mask in a desirable pattern to a selective area of a PCB. Alternatively, an elastomeric transferring apparatus can be used. Various methods can be included to assist in aligning the applicator to the desired area such as an overlaid, dual imaging system.
Claims20
A method of selectively applying solder mask to a Printed Circuit Board, the method comprising the steps:
- repairing solder mask having been damaged as a result of removing at least one of a component and solder from the Printed Circuit Board,
- registering a selective solder mask applicator, the selective solder mask applicator comprising a pattern for applying a solder mask material, to a pattern of electronic pads respective to the damaged solder mask of the Printed Circuit Board, and
- applying the solder mask material proximate the pattern of electronic pads respective to the damaged solder mask on the Printed Circuit Board, wherein the solder mask material is applied between the electronic pads and leaving the electronic pads exposed.
A method of selectively applying solder mask to a Printed Circuit Board, the method comprising the steps:
- repairing solder mask having been damaged as a result of removing at least one of a component and solder from the printed circuit board,
- registering a selective solder mask applicator, the selective solder mask applicator comprising a pattern for applying a heat curable solder mask material, to a pattern of electronic pads respective to the damaged solder mask of the Printed Circuit Board, and
- applying the heat curable solder mask material proximate the pattern of electronic pads respective to the damaged solder mask on the Printed Circuit Board, wherein the heat curable solder mask is applied between the electronic pads and leaving the electronic pads exposed,
- and applying heat to cure the heat curable solder mask.
A method of selectively applying solder mask to a Printed Circuit Board, the method comprising the steps:
- repairing solder mask having been damaged as a result of removing at least one of a component and solder from the printed circuit board,
- registering a selective solder mask applicator to a pattern of electronic pads respective to the damaged solder mask on an Printed Circuit Board, wherein the solder mask applicator is at least one of a stencil and a material transferring apparatus, and
- applying the solder mask material proximate the pattern of electronic pads respective to the damaged solder mask on an Printed Circuit Board, wherein the solder mask material is applied between the electronic pads and leaving the electronic pads exposed.
Dependencies are inferred from the claim text.