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US 6,641,860 B1Granted
Method of manufacturing printed circuit boards
AssigneeT-Ink, Inc.
InventorsTerrance Z. Kaiserman, Keith J. Margolin
Life of this patent
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Abstract
Methods of manufacturing printed circuit boards are disclosed. The methods utilize various printing techniques to apply conductive compositions to substrates in the creation of printed circuit boards. The method of manufacturing printed circuit board comprises the step of applying conductive composition to a substrate through a cold welding process.
Claims15
A method of manufacturing printed circuit boards comprising:
- providing a conductive composition including a liquid vehicle and electrically conductive material therein;
- providing a substrate;
- applying said conductive composition to said substrate by cold welding said conductive composition to said substrate whereby sufficient pressure is applied to said conductive composition such that said conductive material is separated from said liquid vehicle and said conductive material is forced together so that a desired printed circuit pattern is obtained on said substrate.
A method of manufacturing printed circuit boards comprising:
- providing a conductive composition including a liquid vehicle and electrically conductive material therein;
- providing a substrate;
- initially applying said conductive composition, to said substrate;
- and
- subjecting said conductive composition and said substrate to a cold welding process after said conductive composition has been applied to the surface of said substrate whereby sufficient pressure is applied to said conductive composition such that said conductive material is separated from said liquid vehicle and said conductive material is forced together to form a conductive trace on the surface of said substrate.
2 more elements
Dependencies are inferred from the claim text.