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US 6,641,775 B2Granted
Reducing manufacturing and raw material costs for device manufacture with nanostructured powders
AssigneeNanoProducts Corporation
InventorsAnthony Vigliotti, Tapesh Yadav, Clayton Kostelecky, Carrie Wyse
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Abstract
Methods for lowering processing and raw material costs are disclosed. Specifically, the use of nanostructured powders is disclosed for faster and lower sintering temperatures whereby electrodes currently employing platinum can be substituted with lower melting point metals and alloys.
Claims19
A method of reducing the sintering temperature of a device, comprising:
- providing nanostructured ceramic powders of the active material of the device;
- preparing the device from the nanostructured ceramic powders wherein the nanostructured device has a domain size of less than 100 nm and the device comprises at least one metal electrode and at least one active layer;
- and,
- sintering the device at a temperature that is at least 100° C. lower than the sintering temperature necessary for a device prepared from micron-sized powders of the active material.
1 more element
A method of preparing a quantum confined device comprising:
- providing nanostructured ceramic materials with domain sizes where size confinement effects become observable, wherein the size confinement modifies the material properties from the group comprising thermal properties and electrical
- forming and sintering a device component with domain sizes less than 100 nm comprising the nanostructured ceramic materials, the device component comprising at least one metal electrode and one active layer, and
- the resulting device exhibits domain confinement effects.
Dependencies are inferred from the claim text.