Control of semiconductor processing
AssigneeAgere Systems Inc.
InventorsErik Cho Houge, John Martin McIntosh, Edward Alios Rietman
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AssigneeAgere Systems Inc.
InventorsErik Cho Houge, John Martin McIntosh, Edward Alios Rietman
Estimating the term…
An integrated metrology and lithography/etch system and method (10) for micro-electronics device manufacturing. A process control neural network (30) is used to develop an estimated process control parameter (32) for controlling an etching process (28). The process control neural network is responsive to a multi-parameter characterization of a patterned resist feature MPC(PR) (16) developed on a substrate. The process control parameter is used as a feed-forward control for the etching process to develop an actual final mask feature. A multi-parameter characterization of the actual final mask feature MPC(HM) (36) is used as an input to a training neural network (40) for mapping to an ideal process control parameter. The ideal process control parameter is compared to the estimated control parameter to develop an error parameter (46), which is then used to train the process control neural network.
A method of processing a semiconductor wafer, the method comprising:
A method of controlling a semiconductor device manufacturing process comprising using a process control neural network to map a relationship between a multiple parameter characterization of the topography of an in-process feature and a process control parameter value useful to control a process for developing a design feature from the in-process feature.
A system for semiconductor device manufacturing comprising:
A system for control of a semiconductor manufacturing operation, the system comprising:
Dependencies are inferred from the claim text.