Loading patent…
AssigneeMicell Technologies, Inc.
InventorsJames P. DeYoung, James B. McClain, Stephen M. Gross, Joseph M. DeSimone
Estimating the term…
A method of cleaning and removing water and entrained solutes during a manufacturing process from a microelectronic device such as a resist-coated semiconductor substrate, a MEM's device, or an optoelectronic device comprising the steps of: (a) providing a partially fabricated integrated circuit, MEM's device, or optoelectronic device having water and entrained solutes on the substrate; (b) providing a densified (e.g., liquid or supercritical) carbon dioxide drying composition, the cleaning composition comprising carbon dioxide, water, and, optionally but preferably, a cleaning adjunct; (c) immersing the surface portion in the densified carbon dioxide cleaning composition; and then (d) removing the cleaning composition from the surface portion.
A method of cleaning contaminants from a microelectronic device, comprising the steps of:
A method according to claim wherein said cleaning step is initiated with said cleaning composition in a liquid state, and after a period of time said inhibiting step is carried out by diluting said composition with pure liquid CO2 and then heating said composition produce a supercritical fluid, followed by removing said supercritical fluid while maintaining the temperature of the fluid and gas above the critical temperature of CO2.
Dependencies are inferred from the claim text.