Method and apparatus for improving stencil/screen print quality
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Chad A. Cobbley, John VanNortwick
Life of this patent
Estimating the term…
Abstract
A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.
Claims24
A stencil to assist in application of a printable material onto a substrate comprising:
- a first patterned layer;
- a second patterned layer corresponding to and disposed underneath the first patterned layer to retard running of the printable material onto the substrate;
- and
- a third patterned layer containing tungsten corresponding to and disposed over the first patterned layer to promote spreading of the printable material on the substrate.
A screen to assist in application of a printable material onto a substrate comprising:
- a first patterned layer;
- a second patterned layer corresponding to and disposed underneath the first patterned layer to retard running of the printable material onto the substrate;
- and
- a third patterned layer containing tungsten corresponding to and disposed over the first patterned layer to promote spreading of the printable material on the substrate.
A stencil to assist in application of a printable material onto a substrate comprising:
- a first patterned layer;
- a polymeric second patterned layer corresponding to and disposed underneath the first patterned layer to retard running of the printable material onto the substrate;
- and
- a third patterned layer containing tungsten carbide corresponding to and disposed over the first patterned layer to promote spreading of the printable material on the substrate.
A stencil to assist in application of a printable material onto a substrate comprising:
- a first patterned layer;
- a polymeric second patterned layer corresponding to and disposed underneath the first patterned layer to retard running of the printable material onto the substrate;
- and
- a third patterned layer containing tungsten nitride corresponding to and disposed over the first patterned layer to promote spreading of the printable material on the substrate.
A screen to assist in application of a printable material onto a substrate comprising:
- a first patterned layer;
- a polymeric second patterned layer corresponding to and disposed underneath the first patterned layer to retard running of the printable material onto the substrate;
- and
- a third patterned layer containing tungsten carbide corresponding to and disposed over the first patterned layer to promote spreading of the printable material on the substrate.
A screen to assist in application of a printable material onto a substrate comprising:
- a first patterned layer;
- a polymeric second patterned layer corresponding to and disposed underneath the first patterned layer to retard running of the printable material onto the substrate;
- and
- a third patterned layer containing tungsten nitride corresponding to and disposed over the first patterned layer to promote spreading of the printable material on the substrate.
Dependencies are inferred from the claim text.