Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing

An apparatus for planarizing a front surface of a wafer comprising:

• a) a platen for supporting a polishing surface, said platen having a plurality of conduits adapted for communicating a fluid to said front surface;
• b) a motion generator for causing relative motion between said wafer and the polishing surface;
• c) a carousel apparatus for transporting the wafer to the polishing surface;
• d) a manifold having a plurality of channels for delivering the fluid to the conduits of the platen, said manifold positioned beneath the platen wherein at least one plurality of channels has a progressively reduced cross-section;
• and
• e) a slurry delivery conduit adapted for communicating the fluid from a fluid source to the manifold.

An apparatus for planarizing a front surface of a wafer comprising:

• a) a platen for supporting a polishing surface;
• b) a carrier configured to urge said wafer against the polishing surface, said carrier configured to rotate and including a flexible membrane having a front surface for supporting the wafer and a plurality of plenums for exerting different pressures against different areas on a back surface of the membrane;
• c) a motion generator for causing relative motion between the wafer and the polishing surface;
• and
• d) a manifold positioned beneath the platen, wherein the manifold has a plurality of channels for distributing a fluid to the polishing surface.