Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal

A method of polishing a surface of a substrate using an apparatus comprising a polishing pad, a polishing head having a subcarrier with a lower surface, a flexible member extending substantially across the lower surface, the flexible member having a receiving surface adapted to hold the substrate so as to press the substrate against the polishing pad, the flexible membrane including an inner surface in facing opposition with the lower surface of the subcarrier, and wherein the flexible membrane has a control-insert integrally formed therewith, the control insert comprising an annular ring, the method comprising steps of:

• positioning the substrate on the receiving surface of the flexible member;
• pressing the surface of the substrate against the polishing pad to provide a variable rate of removal of material across the surface of the substrate by transmitting a mechanical force applied to the subcarrier through the control-insert to an annular ring shaped area across the substrate;
• and
• providing relative motion between the subcarrier and the polishing pad to polish the surface of the substrate,
• whereby non-planar polishing of the surface of the substrate is inhibited.

A polishing head for positioning a substrate having a surface on a polishing pad of a polishing apparatus, the polishing head comprising:

• a subcarrier adapted to hold the substrate during a polishing operation, the subcarrier having a lower surface;
• a flexible member secured to the subcarrier and extending substantially across the lower surface thereof, the flexible member having:
• a receiving surface adapted to contact the substrate so as to press the substrate against the polishing pad;
• an inner surface in facing opposition with the lower surface of the subcarrier;
• and
• a control-insert attached to the inner surface, the control-insert comprising a thickness that increases from a point proximal to a center of the flexible member to an outer circumferential edge of the control-insert to provide a variable rate of removal of material across the surface of the substrate,
• whereby non-planar polishing of the surface of the substrate is inhibited.

A polishing head for positioning a substrate having a surface on a polishing pad of a polishing apparatus, the polishing head comprising:

• a subcarrier adapted to hold the substrate during a polishing operation, the subcarrier having a lower surface;
• a flexible member secured to the subcarrier and extending substantially across the lower surface thereof, the flexible member having:
• a receiving surface adapted to contact the substrate so as to press the substrate against the polishing pad;
• an inner surface in facing opposition with the lower surface of the subcarrier;
• and
• a control-insert attached to the inner surface, the control-insert comprising a thickness that decreases from a point proximal to a center of the flexible member to an outer circumferential edge of the control-insert to provide a variable rate of removal of material across the surface of the substrate,
• whereby non-planar polishing of the surface of the substrate is inhibited.

A polishing head for positioning a substrate having a surface on a polishing pad of a polishing apparatus, the polishing head comprising:

• a subcarrier adapted to hold the substrate during a polishing operation, the subcarrier having a lower surface;
• a flexible member secured to the subcarrier and extending substantially across the lower surface thereof, the flexible member having a receiving surface adapted to contact the substrate so as to press the substrate against the polishing pad, and an inner surface in facing opposition with the lower surface of the subcarrier;
• a control-insert attached to the inner surface, the control-insert comprising a cross-sectional area having a non-uniform thickness across the receiving surface of the flexible member to provide a variable rate of removal of material across the surface of the substrate;
• and
• wherein the subcarrier further comprises a passageway in communication with the lower surface for providing a pressurized fluid to a chamber defined by the flexible member and the lower surface of the subcarrier, and wherein the flexible member has a thickness having a plurality of holes extending therethrough to the receiving surface for applying the pressurized fluid directly to the substrate;
• and
• wherein the control-insert comprises a disk, and wherein the control-insert includes a second plurality of holes located in a position relative to the plurality of holes in the flexible member to enable the pressurized fluid to be applied directly to the substrate
• whereby non-planar polishing of the surface of the substrate is inhibited.

A method of polishing a surface of a substrate using an apparatus comprising a polishing pad, a polishing head having a subcarrier with a lower surface, a flexible member extending substantially across the lower surface, the flexible member having a receiving surface adapted to hold the substrate so as to press the substrate against the polishing pad, and a control-insert disposed between the flexible member and the lower surface, the control-insert comprises a thickness that increases from a point proximal to a center of the flexible member to an outer circumferential edge of the control-insert, the method comprising steps of:

• positioning the substrate on the receiving surface of the flexible member;
• pressing the surface of the substrate against the polishing pad to provide a rate of removal of material from an outer circumferential edge of the surface of the substrate higher than from a center of the substrate;
• and
• providing relative motion between the subcarrier and the polishing pad to polish the surface of the substrate,
• whereby non-planar polishing of the surface of the substrate is inhibited.

A method of polishing a surface of a substrate using an apparatus comprising a polishing pad, a polishing head having a subcarrier with a lower surface, a flexible member extending substantially across the lower surface, the flexible member having a receiving surface adapted to hold the substrate so as to press the substrate against the polishing pad, and a control-insert disposed between the flexible member and the lower surface, the control-insert comprises a thickness that decreases from a point proximal to a center of the flexible member to an outer circumferential edge of the control-insert, the method comprising steps of:

• positioning the substrate on the receiving surface of the flexible member;
• pressing the surface of the substrate against the polishing pad to provide a rate of removal of material from a center of the surface of the substrate higher than from an outer circumferential edge of the substrate;
• and
• providing relative motion between the subcarrier and the polishing pad to polish the surface of the substrate,
• whereby non-planar polishing of the surface of the substrate is inhibited.

A polishing head for positioning a substrate having a surface on a polishing pad of a polishing apparatus, the polishing head comprising:

• a subcarrier adapted to hold the substrate during a polishing operation, the subcarrier having a lower surface;
• a flexible member secured to the subcarrier and extending substantially across the lower surface thereof, the flexible member having:
• a receiving surface adapted to contact the substrate so as to press the substrate against the polishing pad;
• an inner surface in facing opposition with the lower surface of the subcarrier;
• and
• a control-insert attached to the inner surface, the control-insert comprising an annular ring having a cross-sectional area with a non-uniform thickness across the receiving surface of the flexible member to provide a variable rate of removal of material across the surface of the substrate,
• whereby non-planar polishing of the surface of the substrate is inhibited.

A method of polishing a surface of a substrate using an apparatus comprising a polishing pad, a polishing head having a subcarrier with a lower surface, a flexible member extending substantially across the lower surface, the flexible member having a receiving surface adapted to hold the substrate so as to press the substrate against the polishing pad, and an inner surface with a control-insert comprising an annular ring attached thereto, the control-insert having a cross-sectional area with a non-uniform thickness across the receiving surface of the flexible member, the method comprising steps of:

• positioning the substrate on the receiving surface of the flexible member;
• pressing the surface of the substrate against the polishing pad to provide a variable rate of removal of material across the surface of the substrate by transmitting a mechanical force applied to the subcarrier through the control-insert to various locations across the substrate;
• and
• providing relative motion between the subcarrier and the polishing pad to polish the surface of the substrate,
• whereby non-planar polishing of the surface of the substrate is inhibited.