Resin encapsulation mold

A resin encapsulation mold comprising:

• a lower mold, which is mounted on a lead frame, includes an indentation into which a semiconductor device is placed, and forms a gate through which resin is injected;
• an upper mold, in which an indentation is formed opposite the indentation of said lower mold to configure a cavity for holding said semiconductor device;
• a plurality of ejection pins, which protrude from the respective bottoms of the indentation of said upper mold and the indentation of said lower mold into a resin package body formed by injecting said resin from said gate into said cavity and eject said resin package body;
• a vertical drive mechanism, which brings into contact and separates said upper mold and said lower mold;
• and
• protrusion adjustment means for adjusting the amount of protrusion of the respective ends of the plurality of said ejection pins protruding from the respective bottoms of the indentations of said lower mold and said upper mold comprising said cavity while resin is being injected into said cavity;
• wherein the amount of protrusion of the plurality of said ejection pins ranges between 0 and 60 μm;
• and
• wherein of the plurality of said ejection pins, the ejection pins respectively located in the corners of the indentation of said upper mold and said lower mold opposite said gate are separated from said corner by only a predetermined distance.

A resin encapsulation mold comprising:

• a lower mold, which is mounted on a lead frame, includes an indentation into which a semiconductor device is placed, and forms a gate through which resin is injected;
• an upper mold, in which an indentation is formed opposite the indentation of said lower mold to configure a cavity for holding said semiconductor device;
• a plurality of ejection pins, which protrude from the respective bottoms of the indentation of said upper mold and the indentation of said lower mold into a resin package body formed by injecting said resin from said gate into said cavity and eject said resin package body;
• a vertical drive mechanism, which brings into contact and separates said upper mold and said lower mold;
• and
• protrusion adjustment means for adjusting the amount of protrusion of the respective ends of the plurality of said ejection pins protruding from the respective bottoms of the indentations of said lower mold and said upper mold comprising said cavity while resin is being injected into said cavity;
• wherein the amount of protrusion of the plurality of said ejection pins ranges between 0 and 60 μm;
• and
• wherein there are none of said ejection pins located in the respective corners of the indentation of said upper mold and said lower mold opposite said gate;
• and
• the other plurality of said ejection pins are disposed in the remaining corners of the four corners of the respective said indentations of said upper mold and said lower mold.

A resin encapsulation mold comprising:

• a lower mold, which is mounted on a lead frame, includes an indentation into which a semiconductor device is placed, and forms a gate through which resin is injected;
• an upper mold, in which an indentation is formed opposite the indentation of said lower mold to configure a cavity for holding said semiconductor device;
• a plurality of ejection pins, which protrude from the respective bottoms of the indentation of said upper mold and the indentation of said lower mold into a resin package body formed by injecting said resin from said gate into said cavity and eject said resin package body;
• a vertical drive mechanism, which brings into contact and separates said upper mold and said lower mold;
• and
• a rotational mechanism, which rotates the plurality of said ejection pins.

A resin encapsulation mold comprising:

• a lower mold, which is mounted on a lead frame, includes an indentation into which a semiconductor device is placed, and forms a gate through which resin is injected;
• an upper mold, in which an indentation is formed opposite the indentation of said lower mold to configure a cavity for holding said semiconductor device;
• a plurality of ejection pins, which protrude from the respective bottoms of the indentation of said upper mold and the indentation of said lower mold into a resin package body formed by injecting said resin from said gate into said cavity and eject said resin package body;
• a vertical drive mechanism, which brings into contact and separates said upper mold and said lower mold;
• and
• protrusion adjustment means for adjusting the amount of protrusion of the respective ends of the plurality of said ejection pins protruding from the respective bottoms of the indentations of said lower mold and said upper mold comprising said cavity while resin is being injected into said cavity;
• wherein the amount of protrusion of the plurality of said ejection pins ranges between 0 and 60 μm;
• and
• wherein said vertical drive mechanism is a screw feeding mechanism.