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US 6,641,381 B2Granted
Wafer dicing blade consisting of multiple layers
AssigneeMicron Technology, Inc.
InventorMichael B. Ball
Life of this patent
Estimating the term…
Abstract
The present invention provides a multi-layered diamond dicing blade. More particularly, the blade is a multi-layered dicing blade comprising an inner layer with a first set of diamond particles and an outer layer overlying the inner layer. The inner layer extends to the outermost periphery of the dicing blade. The outer layer comprises a second set of diamond particles having a size smaller than the first set of diamond particles.
Claims29
A dicing saw comprising:
- a rotatable spindle;
- and
- at least one dicing blade coupled to said spindle, said dicing blade comprising:
- an inner layer containing a first set of dicing particles and an outer layer containing a second set of dicing particles overlying said inner layer, said second set of dicing particles having a mean particle size which is smaller than a mean particle size of said first set of dicing particles;
- and
- wherein said inner layer extends beyond said outer layer to the outermost periphery of said dicing blade.
3 more elements
An apparatus for dicing objects comprising:
- a first support for supporting said objects;
- a second support for supporting a dicing saw to dice said objects, said dicing saw comprising:
- a rotatable spindle;
- and
- at least one dicing blade coupled to said spindle, said dicing blade comprising:
- an inner layer containing a first set of dicing particles and an outer layer containing a second set of dicing particles overlying said inner layer, said second set of dicing particles having a mean particle size which is smaller than a mean particle size of said first set of dicing particles;
- and
- wherein said inner layer extends beyond said outer layer to the outermost periphery of said dicing blade.
5 more elements
An apparatus for dicing semiconductor wafers comprising:
- a first wafer support;
- a second support for supporting a dicing saw to dice a wafer placed on said support, said dicing saw comprising:
- a rotatable spindle;
- and
- at least one dicing blade coupled to said spindle, said dicing blade comprising:
- an inner layer containing a first set of dicing particles and an outer layer containing a second set of dicing particles overlying said inner layer, said second set of dicing particles having a mean particle size which is smaller than a mean particle size of said first set of dicing particles;
- and
- wherein said inner layer extends beyond said outer layer to the outermost periphery of said dicing blade.
5 more elements
A method of fabricating a dicing saw comprising the acts of:
- providing a spindle;
- forming at least one dicing blade coupled to said spindle, said dicing blade being formed by the acts of:
- forming an inner layer containing a first set of dicing particles and an outer layer containing a second set of dicing particles overlying said inner layer, said second set of dicing particles having a mean particle size which is smaller than a mean particle size of said first set of dicing particles;
- and
- wherein said inner layer extends to the outermost periphery of said dicing blade.
2 more elements
A method of fabricating a dicing blade comprising the acts of:
- providing a cathode on which plating can occur;
- providing a first plating bath including a first set of large dicing particles and anodes about equally spaced from said cathode when emersed in said first plating bath;
- emersing said cathode in said first plating bath;
- rotating said cathode within said first plating bath at a predetermined speed for a predetermined duration to form an inner layer on said cathode containing said large dicing particles;
- providing a second plating bath including a second set of small dicing particles and anodes about equally spaced from said cathode when emersed in said second plating bath;
- emersing said cathode in said second plating bath;
- rotating said cathode within said second plating bath at a predetermined speed for a predetermined duration to form an outer layer on said cathode containing said small dicing particles;
- and
- forming said inner and outer layer such that said inner layer extends beyond said outer layer to the outermost periphery of said dicing blade.
6 more elements
Dependencies are inferred from the claim text.