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US 6,641,254 B1Granted
Electronic devices having an inorganic film
AssigneeHewlett-Packard Development Company, L.P.
InventorsWilliam R Boucher, Michael G Groh, Todd A. Berdahl
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Abstract
An electronic device includes a substrate, a substrate electrical connector disposed on the substrate, and a carrier lead electrically coupled to the substrate electrical connector. In addition, the electronic device further includes a polymer enclosing the substrate electrical connector, and an inorganic film disposed over the substrate electrical connector in contact with the polymer.
Claims47
An electronic device comprising:
- a substrate;
- a substrate electrical connector disposed on said substrate;
- a carrier lead electrically coupled to said substrate electrical connector;
- a polymer enclosing said substrate electrical connector;
- and
- an inorganic film disposed over said substrate electrical connector and said inorganic film contacts said polymer.
3 more elements
An electronic device comprising:
- a substrate;
- a substrate electrical connector disposed on said substrate;
- a carrier lead electrically coupled to said substrate electrical connector;
- a polymer enclosing said substrate electrical connector;
- an inorganic film disposed over said substrate electrical connector and said inorganic film contacts said polymer, wherein said inorganic film is in the range of about 0.05 microns to about 1.0 microns thick;
- at least one active device disposed on said substrate;
- and
- an electrical trace coupling said at least one active device and said substrate electrical connector.
5 more elements
A fluid ejection head comprising:
- a substrate including:
- at least one fluid ejector disposed thereon;
- and
- a dielectric layer disposed over at least a portion of said substrate;
- a substrate electrical connector in contact with said dielectric layer;
- a substrate carrier including a carrier electrical trace electrically coupled to said substrate electrical connector;
- a polymer enclosing said substrate electrical connector;
- and
- an inorganic film disposed over said substrate electrical connector in contact with said polymer.
6 more elements
A fluid ejection head comprising:
- a substrate including:
- at least one fluid ejector disposed thereon;
- and
- a dielectric layer disposed over at least a portion of said substrate;
- a substrate electrical connector in contact with said dielectric layer;
- a substrate carrier including a carrier electrical trace electrically coupled to said substrate electrical connector;
- a polymer enclosing said substrate electrical connector;
- an inorganic film disposed over said substrate electrical connector in contact with said polymer, wherein said inorganic film is in the range of about 0.05 microns to about 1.0 micron thick;
- at least one transistor disposed on said substrate;
- and
- an electrical trace electrically coupling said at least one transistor to said at least one fluid ejector.
8 more elements
A method of manufacturing a fluid ejection head comprising the steps of:
- fabricating at least one fluid ejector on a substrate;
- forming a substrate electrical connector on said substrate;
- positioning a substrate carrier including a carrier electrical trace in proximity to said substrate;
- electrically coupling said electrical trace to said substrate electrical connector;
- encapsulating said substrate bond bad;
- and
- depositing an inorganic film over said substrate electrical connector.
4 more elements
A method of manufacturing a fluid ejection head comprising the steps of:
- fabricating at least one fluid ejector on a substrate;
- forming a substrate electrical connector on said substrate;
- positioning a substrate carrier including a carrier electrical trace in proximity to said substrate;
- electrically coupling said electrical trace to said substrate electrical connector;
- encapsulating said substrate bond bad;
- depositing an inorganic film over said substrate electrical connector, wherein said inorganic film is in the range of about 0.05 microns to about 1.0 micron thick;
- forming at least one transistor on said substrate;
- and
- electrically coupling said at least one fluid ejector to said at least one transistor.
6 more elements
An electronic device comprising:
- a substrate;
- a carrier;
- means for electrically coupling said carrier to said substrate;
- means for enclosing said electrical connection to said substrate;
- and
- an inorganic film disposed over said means for electrically coupling, wherein said inorganic film is in contact with said means for enclosing said electrical connection to said substrate.
3 more elements
A method of manufacturing an electronic device comprising the steps of:
- forming a substrate electrical connector on a substrate;
- electrically coupling a carrier lead to said substrate electrical connector;
- encapsulating said substrate electrical connector using an encapsulant;
- and
- depositing an inorganic film over said substrate electrical connector in contact with said encapsulant.
2 more elements
Dependencies are inferred from the claim text.