Method of manufacturing a printed circuit board
AssigneeAlps Electric Co., Ltd.
InventorAkihiro Kusaka
Life of this patent
Estimating the term…
Abstract
The printed circuit board according to the invention is highly reliable because a gap width between adjoining first conductive pattern bent parts is formed greater than a gap width in those of wiring parts positioned close to and on both sides of the first conductive pattern bent parts and accordingly, even if any running part arises in the conductive pattern bent parts, short-circuiting is unlikely to occur between wiring patterns, thus making the printed circuit board reliable.
Claims9
A method of manufacturing a printed circuit board, the method comprising the step of:
- providing the printed circuit board which includes wiring patterns having first conductive pattern bent parts and wiring parts linked to the first conductive pattern bent parts, with gaps between adjoining ones of the first conductive pattern bent parts being fanned wider than gaps between the wiring parts positioned close to and on both sides of the first conductive pattern bent parts,
- wherein the wiring patterns are screen-printed on an insulating board, serving as a base of the pointed circuit board, in such a printing direction that first conductive pattern bent parts are printed earlier than the wiring parts.
A method of manufacturing a printed circuit board, the method comprising the step of:
- providing the printed circuit board which includes wiring patterns having first conductive pattern bent parts, first wiring parts linked to the first conductive pattern bent parts, second conductive pattern bent parts bent in a direction reverse to the first conductive pattern bent parts, and second wiring parts linked to the second conductive pattern bent parts, with gaps between adjoining ones of the first conductive pattern bent parts being formed wider than gaps between the first wiring parts positioned close to and on both sides of the first conductive pattern bent parts, and pattern width of the second conductive pattern bent parts being formed greater than pattern width of the second wiring parts positioned close to and on both sides of the second conductive pattern bent parts,
- wherein the first conductive pattern bent parts are printed earlier than the first wiring parts, and the wiring patterns are screen-printed on an insulating board, serving as a base of the printed circuit board, in such a printing direction that the second wiring parts linked to the second conductive pattern bent parts are printed earlier than the second conductive pattern bent parts.
Dependencies are inferred from the claim text.