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US 6,640,423 B1Granted
Apparatus and method for the placement and bonding of a die on a substrate
AssigneeEndwave Corporation
InventorsEdwin F. Johnson, Gerd R. Ley, Douglas G. Lockie, Clifford A. Mohwinkel
Life of this patent
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Abstract
An improved apparatus and method for the placement and bonding of a die on a substrate includes a movable die holder, a movable substrate holder, a pivoting transfer arm that picks a die from the movable die holder and transfers the die to a position adjacent the movable substrate holder, and a bondhead assembly for picking the die from the transfer arm and then bonding the die to the substrate.
Claims69
An assembly for the placement and bonding of a die on a substrate, comprising:
- a carrier device that positions a die holder in a die support position;
- an alignment device aligned with said die support position and operable for manipulating, in the x, y, z and rotational directions, a die support presented to said die support position so as to align a die held on said die support into a predetermined pickup position;
- a transfer arm having an elongate axis, a pivot axis positioned normal to said elongate axis, and a pickup surface, said transfer arm pivoting about said pivot axis to move said pickup surface from the pickup position to a placement position and said transfer arm rotating about said elongate axis so as to rotate said pickup surface approximately 180 degrees about said elongate axis during movement of said pickup surface from said pickup position to said placement position;
- a stationary heater block;
- a substrate gripping device positioned adjacent said heater block and moving in the x, y and rotational directions a substrate gripped within said substrate gripping device so as to align a bonding site on the substrate with a bonding position;
- and
- a bondhead assembly including a bondhead movable between a first position and a second position wherein said bondhead in the first position defines said placement position and said bondhead in the second position defines said bonding position.
4 more elements
An assembly for picking and transferring a die from a pickup position to a placement position for bonding on a substrate, comprising:
- a pickup station that defines a predetermined pickup position and which moves a die holder to align a die on the die holder with said pickup position;
- a bonding station that defines a predetermined placement position and includes a movable bondhead;
- and
- a transfer arm having an elongate axis, a pivot axis positioned normal to said elongate axis, and a pickup surface, said transfer arm pivoting about said pivot axis to move said pickup surface from the pickup position to the placement position, said pickup surface facing a same direction in the pickup position and in the placement position, and said die being transferred directly to the substrate from the transfer arm.
1 more element
An assembly for picking and transferring a die from a pickup position to a placement position for bonding on a substrate, comprising:
- a pickup station that defines a predetermined pickup position and which moves a die holder to align a die on the die holder with said pickup position;
- a bonding station that defines a predetermined placement position and includes a movable bondhead;
- and
- a transfer arm having an elongate axis, a pivot axis positioned normal to said elongate axis, and a pickup surface, said transfer arm pivoting about said pivot axis to move said pickup surface from the pickup position to the placement position, said transfer arm pivoting said pickup surface approximately 180 degrees during movement of said pickup surface from the pickup position to the placement positions, and said transfer arm rotating about said elongate axis so as to rotate said pickup surface approximately 180 degrees about said elongate axis during movement of said pickup surface from said pickup position to said placement position.
1 more element
An assembly for picking and transferring a die from a pickup position to a placement position for bonding on a substrate, comprising:
- a pickup station that defines a predetermined pickup position and which moves a die holder to align a die on the die holder with said pickup position;
- a bonding station that defines a predetermined placement position and includes a movable bondhead;
- and
- a transfer arm having an elongate axis, a pivot axis positioned normal to said elongate axis, and a pickup surface, said transfer arm pivoting about said pivot axis to move said pickup surface from the pickup position to the placement position, said transfer arm including an elbow joint having first and second gears positioned normal to one another wherein said elbow joint causes rotation of said transfer arm about said elongate axis as said transfer arm is pivoted about said pivot axis.
1 more element
An assembly for bonding a die to a substrate, comprising:
- a stationary heater block;
- a bondhead assembly including a bondhead having an elongate axis, a flexure device, and a motor for moving said bondhead toward said heater block along said elongate axis and into a bonding position, said flexure device guiding movement of said bondhead along said elongate axis;
- and
- a substrate gripping device that moves in the x, y and rotational directions a substrate gripped within said substrate gripping device so as to align a bonding site on the substrate with said bonding position.
1 more element
An assembly for aligning a die bond site with a die, comprising:
- a substrate gripping device that moves in the x, y and rotational directions a substrate gripped within said substrate gripping device;
- a bondhead that defines a bonding surface for holding a die;
- an optical device that sequentially displays a real time image of a die held by said bondhead and a real time image of a substrate held within said substrate gripping device;
- and
- an image capture device that forms a template image of said die held by said bondhead and overlays said template image on the real time image of a substrate held within said substrate gripping device.
2 more elements
A method of aligning and bonding a die on a substrate, comprising the steps of:
- aligning a die with a predetermined die pickup position;
- picking the die from the predetermined die pickup position with a transfer assembly;
- transferring the die to a predetermined placement position with said transfer assembly;
- picking said die from the transfer assembly with a bondhead assembly;
- and
- bonding the die to a substrate with said bondhead assembly, said transfer assembly simultaneously pivoting about a pivot axis and rotating about a rotational axis as said transfer assembly transfers said die from the predetermined pickup position to said predetermined placement position.
3 more elements
A method of aligning and bonding a die on a substrate, comprising the steps of:
- aligning a die with a predetermined die pickup position;
- picking the die from the predetermined die pickup position with a transfer assembly;
- transferring the die to a predetermined placement position with said transfer assembly;
- picking said die from the transfer assembly with a bondhead assembly, including
- moving a bondhead of the bondhead assembly along a single axis of movement;
- and
- bonding the die to a substrate with said bondhead assembly.
4 more elements
A method of aligning and bonding a die on a substrate, comprising the steps of:
- aligning a die in the x, y, z and rotational directions with a predetermined die pickup position;
- picking the die from the predetermined die pickup position with a transfer assembly;
- transferring the die to a predetermined placement position with said transfer assembly;
- picking said die from the transfer assembly with a bondhead assembly;
- and
- bonding the die to a substrate with said bondhead assembly.
3 more elements
A method of aligning and bonding a die on a substrate held against a heater block, comprising the steps of:
- aligning a die with a predetermined die pickup position;
- picking the die from the predetermined die pickup position with a transfer assembly;
- transferring the die to a predetermined placement position with said transfer assembly;
- picking said die from the transfer assembly with a bondhead assembly including
- a bonding surface;
- planarizing said bonding surface with respect to said heater block;
- and
- bonding the die to a substrate with said bondhead assembly.
5 more elements
An assembly for the placement and bonding of a die on a substrate, comprising:
- a die support;
- an alignment device that manipulates a die holder supported by said die support so as to align a die held on said die holder into a pickup position;
- a transfer arm having a pivot axis and a pickup surface, said transfer arm pivoting about said pivot axis to move said pickup surface from the pickup position to a placement position wherein said pickup surface faces a first direction in said pickup position and faces a second direction in said placement position and wherein said first direction is different from said second direction;
- a stationary heater block;
- a gripping device positioned adjacent said heater block and moving a substrate gripped within said gripping device so as to align a bonding site on the substrate with a bonding position;
- and
- a bondhead movable between a first position and a second position wherein said bondhead in the first position is aligned with said placement position and said bondhead in the second position is aligned with said bonding position.
4 more elements
An assembly for picking and transferring a die from a pickup position to a placement position for bonding on a substrate, comprising:
- a pickup station that moves a die into alignment with a stationary pickup position;
- a bonding station that moves a substrate into alignment with a stationary placement position;
- and
- a transfer arm having a pivot axis, an elongate axis, and a pickup surface, said transfer arm pivoting approximately 180 degrees about said pivot axis, and rotating approximately 180 degrees about said elongate axis, to move said pickup surface from the pickup position to the placement position wherein said pickup position is different from said placement position.
1 more element
An assembly for picking and transferring a die from a pickup position to a placement position for bonding on a substrate, comprising:
- a pickup station that moves a die into alignment with a stationary first pickup position;
- a bonding station that moves a substrate into alignment with a stationary placement position;
- a first transfer arm having a first pivot axis and a first pickup surface, said first transfer arm pivoting about said first pivot axis to move said first pickup surface from the first pickup position to the placement position wherein said first pickup position is different from said placement position;
- and
- a second transfer arm having a second pivot axis and a second pickup surface, said second transfer arm pivoting about said second pivot axis to move said second pickup surface from a second pickup position to the placement position.
2 more elements
An assembly for bonding a die to a substrate, comprising:
- a bondhead assembly including a bondhead having an elongate axis, a flexure device, and an actuator for moving said bondhead in a line parallel to said elongate axis from a placement position to a bonding position, said flexure device guiding movement of said bondhead parallel to said elongate axis and limiting movement of said bondhead perpendicular to said elongate axis such that said elongate axis of said bondhead in said placement position is parallel to said elongate axis of said bondhead in said bonding position;
- and
- a substrate gripping device that moves a substrate gripped within said substrate gripping device so as to align a bonding site on the substrate with said bonding position.
A method of aligning and bonding a die on a substrate, comprising the steps of:
- aligning a die on a die holder with a stationary die pickup position by moving said die holder in x, y and rotational directions;
- picking the die from the stationary die pickup position with a support surface of a transfer assembly;
- transferring the die to a stationary placement position with said transfer assembly wherein said transfer assembly includes an elongate arm that pivots from said pickup position to said placement position during transfer of said die such that said support surface of said transfer assembly is moved from said pickup position to a placement position;
- picking said die from the transfer assembly with a bondhead assembly wherein a location of said die on said bondhead assembly defines said bonding position;
- aligning a bonding site on a substrate with said bonding position by moving said substrate relative to said bondhead assembly;
- and
- bonding the die to the substrate with said bondhead assembly.
4 more elements
Dependencies are inferred from the claim text.