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AssigneeTyco Electronics Corporation
InventorsScott Hetherton, Wayne Montoya, Thomas Bruguier, Randy Daering
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A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.
A process for manufacturing a composite polymeric circuit protection device, said process comprising
A process for manufacturing a composite polymeric circuit protection device, said process comprising
Dependencies are inferred from the claim text.