Fabrication of a hybrid integrated circuit device including an optoelectronic chip
AssigneeInternational Business Machines Corporation
InventorsH. Bernhard Pogge, Roy Yu, Chandrika Prasad
Life of this patent
Estimating the term…
Abstract
A process is described for integrating an optoelectronic chip and a driver chip on a substrate, in which a waveguide is built into the substrate and the chips are joined to the substrate using a stud/via alignment technique. The waveguide structure includes a reflector and a channel for transmitting light emitted by the optoelectronic chip. A stud formed on the substrate is aligned to a via formed in a layer on the chip, aligning the chip so that the light reaches the reflector and enters the waveguide. A driver chip may be mounted on the substrate in close proximity to the optoelectronic chip.
Claims20
A method for fabricating a semiconductor device including a light-emitting chip mounted on a substrate, the method comprising the steps of:
- forming a waveguide structure in the substrate, the waveguide structure including a reflector for reflecting light emitted by the light-emitting chip and a light-transmitting channel for transmitting the light;
- forming a first layer on the substrate and overlying the waveguide structure, the first layer having a first opening exposing a portion of the substrate and a second opening exposing the reflector;
- forming a stud on the substrate in the first opening;
- forming a second layer on the chip;
- forming a via in the second layer;
- aligning the stud to the via, thereby aligning the chip so that the light is transmitted through the second opening to the reflector;
- and
- attaching the chip to the substrate.
A semiconductor device including a light-emitting chip mounted on a substrate, the device comprising:
- a waveguide structure formed in the substrate, the waveguide structure including a reflector for reflecting light emitted by the light-emitting chip and a light-transmitting channel for transmitting the light;
- a first layer on the substrate and overlying the waveguide structure, the first layer having a first opening exposing a portion of the substrate and a second opening exposing the reflector;
- a stud on the substrate in the first opening;
- and
- a second layer on the chip, the second layer having a via formed therein, wherein
- the chip is attached to the substrate so that the stud is aligned to the via and a light-emitting portion of the chip is aligned to the second opening.
Dependencies are inferred from the claim text.