Compliant heat sink device/mounting system interconnect and a method of implementing same

Abstract

A heat sink device interconnect including a mounting device, having a mounting device top, a board stiffener, wherein the board stiffener is disposed so as to be communicated with the mounting device and a heat sink device compressingly disposed between the mounting device top and the board stiffener, wherein the heat sink device includes a top plate, a bottom plate and a heat sink fin compressingly disposed between the top plate and the bottom plate. A method for implementing a heat sink device interconnect including obtaining an electronic module, a printed circuit board and a heat sink device interconnect having a heat sink device, an interconnect device, a mounting device and a board stiffener, arranging the electronic module, the printed circuit board and the heat sink device interconnect such that the electronic module and the printed circuit board is disposed between the board stiffener and the heat sink device and adjusting the mounting device so as to cause the electronic module to become compressingly associated with the printed circuit board.

Dependencies are inferred from the claim text.