Computer having cooling device
AssigneeHitachi, Ltd.
InventorsMasayuki Saeki, Hironori Oikawa, Takeshi Hizono
Life of this patent
Estimating the term…
Loading patent…
AssigneeHitachi, Ltd.
InventorsMasayuki Saeki, Hironori Oikawa, Takeshi Hizono
Estimating the term…
In an information processing apparatus with a cooling structure using a heat transport measure such as a heat pipe and a liquid-cooling system, a heat radiation unit has reduced thickness and noise and an improved efficiency. Heat generated by a CPU is transmitted through a heat receiving header and a flexible tube to the heat radiation unit by liquid coolant transported by a pump. The heat radiation unit comprises a propeller, a wall surface in contact with the propeller, and a cooling pipe spirally wound around a propeller shaft in a plane perpendicular to the propeller shaft. Hot coolant is circulated so as to enter the central portion of the cooling pipe and to be discharged from the outer peripheral portion of the pipe. The cooling air from the propeller is made to flow from the central portion of the cooling pipe toward its peripheral portion. The cooling pipe is thermally connected to the wall surface so that the wall surface works as a heat spreader.
A cooling device for a computer comprising:
A cooling device for an information processing apparatus comprising:
A cooling device for an information processing apparatus comprising:
Dependencies are inferred from the claim text.