Heat dissipation structures for integrated lead disk drive head suspensions

A method of manufacturing a head suspension or head suspension component having a heat dissipation structure, the method comprising the steps of:

• providing a laminated head suspension material including a conductive layer, an insulating layer and a spring metal support layer;
• and
• forming the laminated material to create predetermined support layer features, predetermined insulating layer features and predetermined conductive layer features for the desired head suspension or head suspension component, the conductive layer features including three dimensional heat dissipation structures integrally created within the conductive layer for dissipating heat in a region of the head suspension or head suspension component.

A method of manufacturing a head suspension or head suspension component having a heat dissipation structure, the method comprising the steps of:

• forming a multiple layer head suspension material including a conductive layer, an insulating layer and a spring metal support layer;
• and
• forming the material to create predetermined support layer features, predetermined insulating layer features and predetermined conductive layer features for the desired head suspension or head suspension component, the conductive layer features including three dimensional heat dissipation structures integrally created within the conductive layer for dissipating heat in a region of the head suspension or head suspension component.

A head suspension or head suspension component including a spring metal support layer, an insulating layer and a conductive layer, the conductive layer having an integrated circuit chip mounting region for receiving an integrated circuit chip including at least one conductive pad configured to electrically connect to at least one electrical connector on the chip, with the conductive layer including at least one conductive trace in electrical connection with the at least one conductive pad to conduct electrical signals to and from the chip, the conductive layer comprising an integral three dimensional heat dissipation structure formed in the conductive trace and positioned adjacent the chip mounting region for dissipating heat from the chip.

A method of manufacturing a head suspension or head suspension component having a heat dissipation structure, the method comprising the steps of:

• providing a laminated head suspension material including a conductive layer, an insulating layer and a spring metal support layer;
• and
• forming the laminated material to create predetermined support layer features, predetermined insulating layer features and predetermined conductive layer features for the desired head suspension or head suspension component, the conductive layer features including an integrated circuit chip mounting region for receiving an integrated circuit chip, the chip mounting region including at least one conductive pad configured to electrically connect to at least one electrical connector on the chip, with the conductive layer also including at least one conductive trace in electrical connection with the at least one conductive pad to conduct electrical signals to and from the chip, the conductive layer features further including an integral three dimensional heat dissipation structure formed in the conductive trace and positioned adjacent the chip mounting region for dissipating heat from the chip.