Wafer stage carrier and removal assembly

A method for removing a carrier for devices constructed in a sub-assembly from a main assembly, comprising:

• providing at least one expandable support attached to the sub-assembly;
• expanding the at least one expandable support until the sub-assembly is supported thereby on a stationary surface;
• detaching the sub-assembly from the main assembly;
• and
• reducing expansion of the at least one expandable support to remove the sub-assembly from the main assembly.

A wafer stage carrier for carrying a wafer stage assembly, the wafer stage carrier being removably connected to an apparatus frame of an exposure apparatus, the wafer stage carrier comprising:

• a wafer stage base plate having a plurality of body supports for attaching the wafer stage carrier to the apparatus frame;
• at least one expandable support, when in an expanded state, supporting the wafer stage carrier on a stationary surface;
• and
• at least one removal support to support and remove the wafer stage carrier away from the exposure apparatus after detaching the wafer stage carrier from the apparatus frame of the exposure apparatus.

A method for removing a wafer stage carrier from an exposure apparatus, the wafer stage carrier being removably connected to an apparatus frame of the exposure apparatus, the method comprising:

• expanding at least one expandable support until the wafer stage carrier is supported thereby on a stationary surface;
• detaching the wafer stage carrier from the apparatus frame;
• and
• reducing expansion of the at least one expandable support to remove the wafer stage carrier from the exposure apparatus.

A method for attaching a carrier for devices constructed in a sub-assembly to a main assembly, comprising:

• providing at least one expandable support attached to the sub-assembly;
• expanding the at least one expandable support until the sub-assembly is supported thereby on a stationary surface;
• attaching the sub-assembly to the main assembly;
• and
• reducing expansion of the at least one expandable support to support the sub-assembly by the main assembly.

A method for making an exposure apparatus, the method comprising steps of:

• providing a main assembly including an exposure device;
• and
• removably attaching a sub-assembly to a part of the main assembly with a removal device, the removal device comprising:
• at least one expandable support attached to the sub-assembly, the at least one expandable support, when in an expanded state, supporting the sub-assembly on a stationary surface;
• and
• at least one removal support to support and remove the sub-assembly away from the main assembly after detaching the sub-assembly from the main assembly.

A removal device to facilitate removing devices constructed in a sub-assembly from a main assembly, the sub-assembly being removably attached to the main assembly, comprising:

• at least one expandable support, when in an expanded state, supporting the sub-assembly on a stationary surface;
• at least one removal support to support and remove the sub-assembly away from the main assembly after detaching the sub-assembly from the main assembly;
• and
• at least one roller guide to facilitate removing the sub-assembly away from the main assembly, the at least one roller guide comprising a first portion of the at least one roller guide provided on an outer periphery of the sub-assembly and a second portion of the at least one roller guide, corresponding to the first portion, provided on an inner periphery of the main assembly,
• wherein the first portion of the at least one roller guide comprises at least one rail, and the second portion of the at least one roller guide comprises at least one cam follower.

A removal device to facilitate removing devices constructed in a sub-assembly from a main assembly, the sub-assembly being removably attached to the main assembly, comprising:

• at least one expandable support, when in an expanded state, supporting the sub-assembly on a stationary surface;
• and
• at least one removal support to support and remove the sub-assembly away from the main assembly after detaching the sub-assembly from the main assembly,
• wherein the at least one expandable support and the at least one removal support are provided on an underside of a base plate of the sub-assembly and positioned adjacent to sections on the underside of the base plate where the sub-assembly attaches to the main assembly.

A method for removing a carrier for devices constructed in a sub-assembly from a main assembly, comprising:

• expanding at least one expandable support until the sub-assembly is supported thereby on a stationary surface;
• detaching the sub-assembly from the main assembly;
• reducing expansion of the at least one expandable support to remove the sub-assembly from the main assembly;
• and
• providing at least one track guide around a periphery of the sub-assembly to facilitate removal of the sub-assembly from the main assembly.