Wideband impedance coupler
AssigneeNokia Corporation
InventorsOlli Salmela, Pertti Ikäläinen
Life of this patent
Estimating the term…
Abstract
The invention is directed to a method for matching characteristic impedances in a wideband manner. The matching of characteristic impedances is realized by tapering a conductor inside a wall composed of a dielectric material. The tapered conductor is either an asymmetric stripline or an asymmetric coplanar line. The method enables characteristic impedance matching at up to 40 GHz. The coupler is applicable to signal line feedthroughs in MMIC packages.
Claims14
A method for matching transmission line characteristic impedances when a transmission line is taken inside a wall made of dielectric material, comprising the steps of:
- bringing the transmission line to the wall made of the dielectric material;
- and
- tapering the transmission line inside the wall made of dielectric material to realize characteristic impedance matching,
- wherein the transmission line is brought to the wall made of dielectric material as a microstrip line and taken inside the wall made of dielectric material as one of an asymmetric stripline, and a coplanar waveguide.
A structure for matching the impedance of a first signal line to the impedance of a second signal line, comprising:
- a wall made of dielectric material;
- a tapered signal line section within said wall, said tapered signal line section having a first end and a second end, the first end being coupled o the first signal line, the second end being coupled to the second signal line,
- wherein the first signal line is a microstrip line, and the tapered signal line section is an asymmetric stripline.
A structure for matching the impedance of a first signal line to the impedance of a second signal line, comprising:
- a wall made of dielectric material;
- a tapered signal line section within said wall, said tapered signal line section having a first end and a second end, the first end being coupled to the first signal line, the second end being coupled to the second signal line,
- wherein the first signal line is a microstrip line, and the tapered signal line section is a coplanar waveguide.
An integrated circuit package which comprises a microcircuit that includes at least one coupling point and a first ground plane, the package comprising:
- a wall made of dielectric material;
- a signal line, a first end of which being located outside the package, a second end of which being located inside the package and being coupled to said coupling point on the microcircuit through coupling means;
- and
- a grounding point on the microcircuit, coupled to said first ground plane,
- wherein the signal line extends from said first end towards said wall as a microstrip line and continues into said wall as a tapered signal line section that is one of an asymmetric stripline, and a coplanar waveguide.
Dependencies are inferred from the claim text.