Common probe card for flip-chip devices

A method to test multiple integrated circuit device designs using a single probe card design, said method comprising:

• providing a plurality of integrated circuit device designs each having a two dimensional probe pad comprising a fixed pitch wherein said probe pad array is greater than two rows and greater than two columns and wherein said probe pads comprise flip chip bumps;
• loading a first said integrated circuit device on a probing stage;
• probing said first integrated circuit device using a vertical probe card comprising a two dimensional probe tip array wherein said probe tip array comprises the same said fixed pitch, wherein said probe tip array is greater than two rows and greater than said two columns, wherein said probe tip array comprises a larger number of elements than said probe pad array, wherein excess said probe tips do not damage said first integrated circuit device, and wherein an automated tester is thereby coupled to said first integrated circuit device;
• testing said first integrated circuit device with said automated tester;
• and
• repeating said steps of loading, probing, and testing, for at least one other said integrated circuit device having a differing design than said first integrated circuit device.