Method and apparatus for testing semiconductor dice

An apparatus for testing a semiconductor die comprising:

• a base for retaining the die comprising an active surface and a plurality of conductors on the active surface, each conductor having a plurality of bonding sites along a length thereof;
• an interconnect on the conductors and the active surface configured to electrically contact the die;
• and
• an insulating member between the interconnect and the conductors;
• the conductors and the bonding sites configured for forming a plurality of first electrical paths between the interconnect and first selected bonding sites having first minimized path lengths, or for forming a plurality of second electrical paths between a second interconnect having a different size than the interconnect and second selected bonding sites having second minimized path lengths.

An apparatus for testing a semiconductor die comprising:

• a base for retaining the die;
• a plurality of conductors on the base comprising a plurality of first bonding sites and a plurality of second bonding sites;
• an interconnect on the base configured to electrically contact the die;
• and
• a plurality of wires bonded to the first bonding sites and to the interconnect, the first bonding sites selected to minimize lengths of the wires;
• the conductors configured for wire bonding a plurality of second wires and a second interconnect in place of the interconnect configured to electrically contact a second die, the second bonding sites configured to minimize lengths of the second wires.

An apparatus for testing a semiconductor die comprising:

• a base for retaining the die;
• a plurality of conductors on the base comprising a plurality of first bonding sites and a plurality of second bonding sites;
• an interconnect on the base configured to electrically contact the die;
• and
• a plurality of electrical members bonded to the first bonding sites and to the interconnect, the first bonding sites selected to minimize lengths of the electrical members;
• the conductors configured for bonding second electrical members and a second interconnect in place of the interconnect configured to electrically contact a second die, the second bonding sites configured to minimize lengths of the second electrical members.