Semiconductor device and its manufacturing method

A semiconductor device comprising:

• a semiconductor chip including semiconductor elements on main surface thereof and a plurality of connection terminals, said plurality of connection terminals being arranged along a pair of opposite sides of said semiconductor chip;
• an elastic body arranged on the main surface of said semiconductor chip and said connection terminals being exposed;
• an insulating tape formed on said elastic body comprising openings in an area where said connection terminals are arranged;
• a plurality of leads formed on the surface of said insulating tape, in which first ends thereof are respectively electrically connected to corresponding ones of said connection terminals and second ends thereof are arranged over said elastic body, respectively;
• a plurality of bump electrodes formed at said second ends of said plurality of leads;
• and
• a resin body for sealing said connection terminals of said semiconductor chip and said one end of leads;
• wherein said elastic body is made of a porous material and part of a side surface of said elastic body is exposed.

A semiconductor device comprising:

• a semiconductor chip including semiconductor elements on a main surface thereof and a plurality of connection terminals, said plurality of connection terminals being arranged along a pair of opposite sides of said semiconductor chip;
• an elastic body arranged on the main surface of said semiconductor chip and said connection terminals being exposed;
• an insulating tape formed on said elastic body comprising openings in an area where said connection terminals are arranged;
• a plurality of leads formed on the surface of said insulating tape, in which first ends thereof are respectively electrically connected to corresponding ones of said connection terminals and second ends thereof are arranged over said elastic body, respectively;
• a plurality of bump electrodes formed at said second ends of said plurality of leads;
• and
• a resin body for sealing said connection terminals of said semiconductor chip and said first ends of said plurality of leads;
• wherein said elastic body comprises a skeleton layer formed from a three-dimensional mesh structure and part of a side surface of said elastic body is exposed.