Flip-chip transition interface structure
AssigneeApplied Micro Circuits Corporation
InventorRobert B. Welstand
Life of this patent
Estimating the term…
Abstract
A flip-chip transition interface structure is suitable for use in high speed applications that require low return losses. The transition interface includes a conductive signal element and two conductive reference elements formed on a flip-chip die substrate. A signal solder bump is located at a signal bond pad formed at an end of the conductive signal element, and a reference solder bump is located at each conductive reference element. The conductive elements are configured to form a substantially round cutout region surrounding the signal bond pad. The positions of the solder bumps on the respective conductive elements are selected in a manner that enhances the impedance matching of the transition interface structure.
Claims24
A flip-chip transition interface structure comprising:
- a conductive signal element formed on a substrate;
- a substantially round bond pad formed on said substrate, said conductive signal element ending at said bond pad;
- a first conductive reference element formed on said substrate, said first conductive reference element including a first substantially curved edge;
- a second conductive reference element formed on said substrate, said second conductive reference element including a second substantially curved edge;
- and
- a cutout region defined at least in part by said first curved edge and said second curved edge.
A flip-chip transition interface structure comprising:
- a first substrate;
- a second substrate;
- a first conductive signal element formed on said first substrate;
- a substantially round first bond pad formed on said first substrate, said first conductive signal element ending at said first bond pad;
- a first conductive reference element formed on said first substrate, said first conductive reference element including a first substantially curved edge;
- a second conductive reference element formed on said first substrate, said second conductive reference element including a second substantially curved edge;
- a second conductive signal element formed on said second substrate;
- a substantially round second bond pad formed on said second substrate, said second conductive signal element ending at said second bond pad;
- a conductive interconnect element formed between said first bond pad and said second bond pad;
- and
- a cutout region defined at least in part by said first curved edge and said second curved edge.
A flip-chip transition interface structure comprising:
- a conductive signal element formed on a substrate;
- a substantially round bond pad formed on said substrate, said conductive signal element ending at said bond pad;
- a first conductive reference element formed on said substrate, said first conductive reference element including a first plurality of segmented edge sections that define a first substantially curved edge;
- a second conductive reference element formed on said substrate, said second conductive reference element including a second plurality of segmented edge sections that define a second substantially curved edge;
- and
- a cutout region defined at least in part by said first plurality of segmented edge sections and said second plurality of segmented edge sections.
Dependencies are inferred from the claim text.