Solder bump structure and a method of forming the same
AssigneeAdvanced Micro Devices, Inc.
InventorsMathias Boettcher, Gisela Schammler, Frank Kuechenmeister
Life of this patent
Estimating the term…
Abstract
A solder bump structure and a method for forming the same are disclosed. Over a contact pad a first and a second metal film are deposited, wherein the second metal film is patterned prior to the deposition of a solder bump material such that an opening isolates an inner region of the second metal film from an outer region of the second metal film. The solder material deposited on the inner region and, at least partially, in the opening serves as an etch stop for a subsequent removal of the outer region.
Claims25
A method of forming a solder bump, comprising:
- providing a substrate having formed thereon a contact pad and a passivation layer partially covering the contact pad;
- depositing a first metal film on the substrate;
- depositing a second metal film on the first metal film;
- patterning the second metal film to form an opening, the opening defining an inner region of the second metal film isolated from an outer region of the second metal film;
- and
- depositing a metal on the inner region and in said opening.
A solder bump structure comprising:
- a substrate having a contact pad formed in a passivation layer;
- a first metal film formed on the contact pad;
- a second metal film formed on the first metal film, the second metal film including:
- an inner region above the contact pad,
- an opening formed in the second metal film around the contact pad, and
- an outer region isolated from the inner region by said opening;
- and
- a solder bump formed on the inner region of the second metal film and, at least partially, in said opening.
Dependencies are inferred from the claim text.