Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component

A multilayer ceramic electronic component comprising:

• an electronic component body including a plurality of ceramic layers which are stacked on each other, the electronic component body including opposing first and second major surfaces and a side surface which connects the first and second major surfaces;
• a notch extending from the first major surface to the second major surface and being formed in the side surface;
• a joining electrode defined by a divided via hole conductor and located at a portion of an inside surface defining the notch;
• a component mounted on the first major surface;
• a cover having an opening and being arranged so as to cover the component with the opening of the cover facing the electronic component body, the cover having a leg which is positioned inside the notch, and the cover being secured to the electronic component body by joining the leg to the joining electrode;
• and
• an external terminal electrode connecting the multilayer ceramic electronic component to a wiring substrate and being disposed on the second major surface.