Pin arrangement for high frequency integrated circuit

A semiconductor integrated circuit comprising a first amplifier for a first frequency band and a second amplifier for a second frequency band into which reception signals are to be inputted, the second frequency band being different from the first frequency band, and a receiving mixer for the first frequency band and a receiving mixer for the second frequency band into which outputs from said first amplifier and from said second amplifier are to be respectively inputted, on one chip,

• wherein a circuit corresponding to one of said first and second amplifiers is provided at a location such that a distance from a pin end projecting to outside a package to a pad connected to said one of said first and second amplifiers is the shortest in comparison with distances from ends of other lead pins to pads corresponding thereto,
• wherein each of said first and second amplifiers has a bias circuit connected thereto,
• wherein each amplifier and corresponding bias circuit is provided with a ground pin, respectively,
• wherein each of said first and second amplifiers has a first terminal connected to said ground pin, a second terminal connected to an input pin and a third terminal connected to an output pin of that amplifier, and
• wherein the input pins and ground pins are disposed off of a single side of said one chip, said input pins are to be applied with signals of different frequencies from each other.