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US 6,639,309 B2Granted
Memory package with a controller on one side of a printed circuit board and memory on another side of the circuit board
AssigneeSanDisk Corporation
InventorRobert F. Wallace
Life of this patent
Estimating the term…
Abstract
A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated into a microprocessor controlled device or alternatively is integrated into a portable memory card.
Claims30
A memory package comprising:
- a first circuit board having two faces, the first circuit board comprising a memory die on a first face of the circuit board and a controller die on the second face;
- a second circuit board having two faces and an opening, the first face of the second circuit board affixed to the second face of the first circuit board such that the controller die is within the opening;
- and
- vias connecting the memory die to the second face of the second circuit board, and connecting the memory die to the controller die.
1 more element
A memory package comprising:
- a circuit board having a first and second face, the second face having a recess;
- a memory die attached to the first face of the circuit board, the memory die positioned above the recess;
- a controller die attached to and positioned within the recess of the second face of the circuit board, the second face of the circuit board forming a second face of the package;
- and
- vias connecting the memory die to the second face of the circuit board.
2 more elements
A memory card comprising:
- a first circuit board having a first and second face;
- a memory package comprising a second circuit board, a controller die attached to first face of the second circuit board, and a memory die attached to a second face of the second circuit board, and wherein
- the memory package is attached to the first face of the first circuit board;
- and a set of contacts on the second face of the first circuit board.
1 more element
A microprocessor controlled device comprising:
- a memory chip package comprising a circuit board having a first and second face, a controller die attached to the first face, and a memory die attached to the second face;
- one or more input-output devices;
- random access memory;
- and
- a microprocessor.
2 more elements
A memory chip package comprising:
- a circuit board having first and second opposing faces;
- a FLASH EEPROM having memory cells, the EEPROM attached to the first face of the circuit board;
- a controller having a control logic, the controller attached to the second face of the circuit board and configured to read and write data to the memory cells on the first face;
- and
- data lines connecting the controller die to the EEPROM and operable to transfer data to and from the memory cells.
2 more elements
Dependencies are inferred from the claim text.