Cover tape for packaging electronic elements
AssigneeSumitomo Bakelite Co., Ltd.
InventorsTsuyoshi Marumo, Hisao Nakanishi
Life of this patent
Estimating the term…
Abstract
A cover tape for packaging electronic elements capable of being heat-sealed to a polycarbonate carrier tape having regularly formed pockets for containing electronic elements, which cover tape comprises (A) a substrate layer comprising a thermoplastic resin having a load deflection temperature (ASTM D-648) under a load of 1.82 MPa of not lower than 60° C., and (B) a heat seal layer comprising at least one resin selected from polyvinyl chloride resin, polyester resin, polyurethane resin, acrylic resin containing a functional group and ethylene copolymer which have a Tg of 30-60° C., and an electroconductive fine powder dispersed in said resin.
Claims7
A cover tape for packaging electronic elements capable of being heat-sealed to a polycarbonate carrier tape having regularly formed pockets for containing electronic elements, which cover tape comprises (A) a substrate layer comprising a thermoplastic resin having a load deflection temperature (ASTM D-648) under a load of 1.82 MPa of not lower than 60° C., and (B) a heat seal layer comprising at least one resin selected from polyvinyl chloride resin, polyester resin, polyurethane resin, acrylic resin containing a functional group and ethylene copolymer which have a Tg of 30-60° C., and an electroconductive fine powder dispersed in said resin.
Dependencies are inferred from the claim text.