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US 6,639,302 B2Granted
Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries
AssigneeInternational Business Machines Corporation
InventorsKrishna Darbha, Miguel A. Jimarez, Matthew M. Reiss, Sanjeev B. Sathe, Charles G. Woychik
Life of this patent
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Abstract
A method and structure to electrically couple a semiconductor device to a substrate that is divided into a plurality of segments. Alternatively, a semiconductor device may be divided into a plurality of segments and the plurality of segments are electrically coupled to a single substrate.
Claims25
An electronic structure, comprising:
- a chip carrier, wherein the chip carrier is selected from the group consisting of a ceramic chip carrier and an organic chip carrier, and wherein the chip carrier is divided into a plurality of lateral segments, and
- a semiconductor device, wherein discrete sections of the semiconductor device are electrically coupled to each of the segments.
A method for forming an electronic structure, comprising:
- dividing a substrate into a plurality of lateral segments, wherein the substrate is selected from the group consisting of a ceramic chip carrier, an organic chip carrier, and a printed circuit board, and
- electrically coupling discrete sections of the semiconductor device to each segment of the plurality of segments of the substrate.
An electronic structure, comprising:
- a printed circuit board, wherein the printed circuit board is divided into a plurality of lateral segments, and
- a semiconductor device, wherein discrete sections of the semiconductor device are electrically coupled to each of the segments.
Dependencies are inferred from the claim text.