Active matrix display device having high intensity and high precision and manufacturing method thereof
AssigneeSharp Kabushiki Kaisha
InventorsMasahito Gotoh, Tohru Ueda
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AssigneeSharp Kabushiki Kaisha
InventorsMasahito Gotoh, Tohru Ueda
Estimating the term…
An a-Si film 12 is formed on the whole surface of a quartz substrate 11, and a protection film 13 is formed in a region to be used as a display unit on the a-Si film 12. Subsequently, after a catalyst metal is selectively introduced into the whole surface of a region to be used as a peripheral drive circuit on the a-Si film 12, crystal growth is allowed by heating the a-Si film 12 to form a CG silicon film 14 and a p-Si film 15. Then, the catalyst metal in the CG silicon film 14 and the p-Si film 15 is removed by gettering. The concentration of the catalyst metal in the CG silicon film 14 is in the range of 1×1013 atoms/cm13 or higher and lower than 1×1015 atoms/cm3. The concentration of the catalyst metal in the p-Si film for a display unit 15 is made lower than the concentration of the catalyst metal in the CG silicon film 14b for a peripheral drive circuit. Thereby, a semiconductor device having a driver monolithic type liquid crystal display device with high intensity, high precision and uniform characteristics can be achieved.
A semiconductor device including a display unit having pixel electrodes arranged in a matrix and transistors for a pixel connected to the pixel electrodes and a peripheral drive circuit having a transistor for a peripheral drive circuit provided outside the display unit, wherein
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