Hermetic package for surface acoustic wave device having exposed device substrate contacts and method of manufacturing the same

A method of manufacturing a hermetic package for an electronic device, comprising:

• forming a device substrate having:
• an active region containing an electrically conductive
• pattern that constitutes at least a portion of said device,
• a contact region surrounding said active region and containing bond pads that are electrically coupled to said pattern, and
• a bonding region surrounding said active region;
• forming a non-porous mounting substrate having a bonding region thereon and a footprint smaller than a footprint of said device substrate;
• and
• placing a bonding agent between said bonding region of said device substrate and said bonding region of said mounting substrate to bond said device substrate to said mounting substrate to enclose said active region proximate a void between said device substrate and said mounting substrate, said contact region remaining exposed.

A method of manufacturing a hermetic package for a plurality of surface acoustic wave (SAW) devices, comprising:

• arranging said plurality of SAW devices on a device substrate wafer such that active regions thereof are surrounded by contact regions containing bond pads that are electrically coupled to said SAW devices, said active regions also surrounded by bonding regions;
• forming a non-porous mounting substrate having bonding regions thereon that correspond to said bonding regions of said device substrate wafer;
• placing a bonding agent between said bonding regions of said device substrate wafer and said bonding regions of said mounting substrate, that bonds said device substrate to said mounting substrate to enclose said active regions proximate voids between said device substrate wafer and said mounting substrate;
• and
• removing at least a portion of said mounting substrate to expose said bond pads.