Integration of monocrystalline oxide devices with fully depleted CMOS on non-silicon substrates
AssigneeMotorola, Inc.
InventorsRobert Croswell, Gregory Dunn
Life of this patent
Estimating the term…
Loading patent…
AssigneeMotorola, Inc.
InventorsRobert Croswell, Gregory Dunn
Estimating the term…
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy and epitaxial growth of single crystal silicon onto single crystal oxide materials. Monocrystalline substrates having a hydrogen ion implant are cleaved along the hydrogen ion implant, and an insulating substrate is bonded to the monocrystalline oxide.
A structure (120), comprising:
A structure (120), comprising:
A process for fabricating a semiconductor structure (120), said process comprising:
Dependencies are inferred from the claim text.