Forming a structure on a wafer
AssigneeInfineon Technologies AG
InventorsAxel Brintzinger, Barbara Vasquez, Harry Hedler
Life of this patent
Estimating the term…
Abstract
A method for fabricating a structure on an integrated circuit (IC) wafer, includes providing a material onto a surface of the wafer and shaping the material to have a shape corresponding to the structure. The method can also include removing a remaining portion of the material, depositing a seed layer onto the wafer and the material, and depositing a photoresist on the wafer. In addition, the method can include depositing a metal layer on top of the seed layer, removing the photoresist, etching the seed layer, and etching the material. The resulting structure is usable as a compression stop, a compliant element or a rerouting layer or a combination thereof.
Claims21
A method for fabricating a structure on an integrated circuit (IC) wafer, comprising:
- printing a material onto a surface of the wafer;
- and
- shaping the material to have a shape corresponding to the structure, the structure having a combination of at least two elements from the group consisting of a compression stop, a compliant element, and a rerouting layer.
A method for fabricating a structure on an integrated circuit (IC) wafer, comprising:
- providing a material onto a surface of the wafer;
- and
- embossing the material to have a shape corresponding to the structure, the structure having a combination of at least two elements from a group of elements comprising a compression stop, a compliant element, and a rerouting layer.
Dependencies are inferred from the claim text.