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US 6,638,865 B2Granted
Manufacturing method of semiconductor chip with adhesive agent
AssigneeKabushiki Kaisha Toshiba
InventorKazuyasu Tanaka
Life of this patent
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Abstract
A semiconductor wafer on which elements have been formed is diced and a rear surface of the semiconductor wafer is ground by a dicing before grinding method to form discrete semiconductor chips. The discrete semiconductor chips are adhered to an adhesive film and then the surface of the adhesive film is removably affixed to a dicing tape. After this, any excess portions of the adhesive film disposed between the respective semiconductor chips are removed.
Claims4
A method for manufacturing a semiconductor device comprising the steps of:
- dicing a semiconductor wafer on which elements have been formed and grinding a rear surface of the semiconductor wafer by a dicing-before-grinding method to form discrete semiconductor chips;
- adhering each of the discrete semiconductor chips to an adhesive film having a first surface and a second surface, said adhesive film comprising thermoplastic resin, unset thermosetting resin or a combination of thermoplastic resin and unset thermosetting resin, and said first surface of said adhesive film being adhered to said rear surface of said semiconductor chips;
- removably affixing the second surface of the adhesive film to a dicing tape;
- and
- removing any excess portions of the adhesive film disposed between the respective semiconductor chips by chemical etching, using one of an organic solvent, an acid solution and an alkaline solution.
2 more elements
Dependencies are inferred from the claim text.