Hole metal-filling method
AssigneeUnimicron Taiwan Corp.
InventorDavid C. H. Cheng
Life of this patent
Estimating the term…
Abstract
A hole metal-filling method, applied to hole filling and electroplating a printed circuit board which has been mechanical-drilled with holes. A plurality of holes is drilled in a substrate. The substrate is placed on a platform. A plurality of metal balls is disposed on a surface of the substrate. By vibrating the platform, a part of the metal balls roll into the holes, while the metal balls not rolling into the holes are removed. The substrate is then placed on a press down unit. The metal balls in the holes are pressed to level with surfaces of the substrate. The substrate is directly electroplated for forming a plating layer closely dovetail to the metal balls.
Claims10
A hole metal-filling method, comprising:
- providing a substrate, which has a plurality of through holes;
- placing the substrate on a platform;
- disposing a plurality of metal balls on the substrate;
- vibrating the platform, so tat a part of the metal balls roll into the holes, while the metal balls that do not fall into the holes are removed;
- placing the substrate on a press down unit to press the metal balls into the holes until the metal balls are leveled with a surface of the substrate, wherein an upper portion and a bottom portion of the metal balls come in direct contact with the press down unit;
- and
- directly electroplating the substrate to form a plating layer closely adjacent to the metal balls.
Dependencies are inferred from the claim text.