Method for protecting the front side of semiconductor wafers
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPei-Haw Tsao, Chender Huang, Jones Wang, Ken Chen, Hank Huang
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Abstract
A method of protecting the active surface, front side, of semiconductor wafers during the operations of backside grinding, transporting, and packaging has been achieved. The invention discloses a method for applying an organic passivation layer or an aqueous material for protection of the active components. These materials are easily removed prior to final packaging of the dies.
Claims14
A method for protecting a front side of a semiconductor wafer that includes solder bumps, comprising:
- depositing an organic passivation layer comprising benzotriazole over a semiconductor substrate;
- applying a layer of adhesive tape over said organic passivation layer;
- thining the semiconductor substrate by backside grinding;
- vaporizing the organic passivation layer;
- and
- thereafter removing the adhesive tape.
A method that utilizes an aqueous compound to protect a microlens of a CMOS image sensor on an integrated circuit wafer, said method comprising:
- coating an active surface of a finished said integrated circuit wafer with an aqueous compound comprising benzotriazole to form an organic passivation layer;
- thereafter processing the integrated circuit wafer;
- thereafter removing the organic passivation layer;
- and
- thereafter sealing said CMOS image sensor in a package.
A method for protecting a front side of a semiconductor wafer that includes solder bumps, comprising:
- depositing an organic passivation layer comprising benzimidazole over a semiconductor substrate;
- applying a layer of adhesive tape over said organic passivation layer;
- thining the semiconductor substrate by backside grinding;
- vaporizing the organic passivation layer;
- and
- thereafter removing the adhesive tape.
Dependencies are inferred from the claim text.