US 6,638,793 B1Granted

Methodology to pack standard staggered bond input-output buffer into linear input-output buffer

AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.

InventorChung-Hui Chen

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Abstract

A new method is provided that allows placing or stacking staggered bond I/O buffers into linear bond I/O buffers. The bond pads are linearly arranged, the interface between the staggered bond pad I/O buffers and the linearly arranged bond pads is achieved by a frame design that sequentially connects the staggered bond pad I/O buffers to the linearly arranged bond pads.

Claims14

Dependent claims

A method to connect staggered bond pad Input/Output (I/O) buffers to linearly arranged bond pads, comprising the steps of:

providing a substrate, semiconductor devices having been created in or on the surface of said substrate, at least one Integrated Circuit (IC) die having been separated from said substrate, said at least one Integrated Circuit (IC) having been provided with bond pad I/O buffers around the perimeter of said at least one IC die;
providing an IC support surface for mounting said at least one IC on a surface thereof, bond pads having been provided on the surface of said IC support surface, said bond pads being aligned with said bond pad I/O buffers provided around the perimeter of said at least one IC die;
dividing said bond pad I/O buffers around the perimeter of said at least one IC die into at least one first subset, having a first number of bond pad I/O buffers;
dividing said bond pads having been provided on the surface of said IC support surface into at least one second subset, having a second number of bond pads, said second number of bond pads being equal to said first number of bond pad I/O buffers, said at least one second subset of bond pads being aligned with said at least one first subset of bond pad I/O buffers, said at least one second subset of bond pads being arranged in a sequence that perpendicularly protrudes for said perimeter of said at least one IC die;
assigning numerical values to each element of said at least one first subset of bond pads I/O buffers and to each element of said at least one second subset of bond pads by assigning consecutive numbers starting with a number one to each element of said at least one first subset of bond pads I/O buffers and each element of said at least one second subset of bond pads;
matching elements of said at least one first subset of bond pads I/O buffers with elements of equal numerical numbers of said at least one second subset of bond pads, creating matched elements;
and
interconnecting said matched elements of said at least one first subset of bond pad I/O buffers and said at least one second subset of bond pads with a conductive material.

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Dependencies are inferred from the claim text.

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Abstract

A method to connect staggered bond pad Input/Output (I/O) buffers to linearly arranged bond pads, comprising the steps of:

providing a substrate, semiconductor devices having been created in or on the surface of said substrate, at least one Integrated Circuit (IC) die having been separated from said substrate, said at least one Integrated Circuit (IC) having been provided with bond pad I/O buffers around the perimeter of said at least one IC die;
providing an IC support surface for mounting said at least one IC on a surface thereof, bond pads having been provided on the surface of said IC support surface, said bond pads being aligned with said bond pad I/O buffers provided around the perimeter of said at least one IC die;
dividing said bond pad I/O buffers around the perimeter of said at least one IC die into at least one first subset, having a first number of bond pad I/O buffers;
dividing said bond pads having been provided on the surface of said IC support surface into at least one second subset, having a second number of bond pads, said second number of bond pads being equal to said first number of bond pad I/O buffers, said at least one second subset of bond pads being aligned with said at least one first subset of bond pad I/O buffers, said at least one second subset of bond pads being arranged in a sequence that perpendicularly protrudes for said perimeter of said at least one IC die;
assigning numerical values to each element of said at least one first subset of bond pads I/O buffers and to each element of said at least one second subset of bond pads by assigning consecutive numbers starting with a number one to each element of said at least one first subset of bond pads I/O buffers and each element of said at least one second subset of bond pads;
matching elements of said at least one first subset of bond pads I/O buffers with elements of equal numerical numbers of said at least one second subset of bond pads, creating matched elements;
and
interconnecting said matched elements of said at least one first subset of bond pad I/O buffers and said at least one second subset of bond pads with a conductive material.

5 more elements