Fabrication method of semiconductor integrated circuit device and testing method
AssigneesHitachi, Ltd., Hitachi Hokkai Semiconductor, Ltd.
InventorTomohiro Taira
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AssigneesHitachi, Ltd., Hitachi Hokkai Semiconductor, Ltd.
InventorTomohiro Taira
Estimating the term…
A probe inspection system is used in integrated circuit fabrication and testing, using a network, including probers, testers, manufacturing specification management, testing step control and test results management, which has a modified prober software. Lots are set successively to cassettes, and when the lot in another cassette is set after the end of processing of the lot in one cassette, processing of the next lot is executed automatically. Continuous lot inspection can be effected by repeating these operations. Even during processing of the next lot, it is always possible to change lot in the processing-completed cassette and input data, such as lot No. In probe check in wafer testing, it is possible to diminish the working load and the waiting of workers in the lot change, reduce the number of cassettes and improve the working efficiency of testers.
A method of testing a semiconductor integrated circuit device, comprising the steps of:
Dependencies are inferred from the claim text.