Selective electroplating method employing annular edge ring cathode electrode contact

A method for forming an electroplated patterned conductor layer comprising:

• providing a substrate;
• forming over the substrate a blanket electroplating seed layer;
• forming over the blanket electroplating seed layer a blanket photoresist layer formed of a negative photoresist material;
• photoexposing the blanket photoresist layer to form a photoexposed blanket photoresist layer while employing a photoexposure apparatus which employs an annular edge ring exclusion apparatus positioned over an annular edge ring of the blanket photoresist layer and the blanket electroplating seed layer, where the annular edge ring of the blanket electroplating seed layer extends inward from an edge of the substrate;
• developing the photoexposed blanket photoresist layer to form a patterned photoresist electroplating mask layer having an annular edge ring excluded over the annular edge ring of the blanket electroplating seed layer;
• contacting to the annular edge ring of the blanket electroplating seed layer a annular cathode electrode ring;
• and
• plating, while employing an electroplating method in conjunction with the patterned photoresist electroplating mask, a patterned conductor layer upon the blanket electroplating seed layer.