Photosensitive laminate, process for forming resist pattern using same and positive resist composition

A positive resist composition comprising:

• (A) a compound which generates an acid upon irradiation with radioactive ray,
• (B) an alkali-soluble novolak resin, and
• (C) a compound having at least one acid-decomposable dissolution-inhibiting group, said dissolution-inhibiting group being decomposable by action of an acid generated from said ingredient (A) to yield an organic carboxylic acid,
• wherein said ingredient (C) is a bile acid ester having a weight average molecular weight in a range from 100 to 1500 and containing at least one acid-decomposable dissolution-inhibiting group.

A positive resist composition comprising:

• (A) a compound which generates an acid upon irradiation with radioactive ray,
• (B) an alkali-soluble novolak resin, and
• (C) a compound having at least one acid-decomposable dissolution-inhibiting group, said dissolution-inhibiting group being decomposable by action of an acid generated from said ingredient (A) to yield an organic carboxylic acid,
• wherein said ingredient (C) concurrently satisfies both the following conditions (c-1) and (c-1-1).
• (c-1):
• being a compound having a weight average molecular weight in a range from 100 to 1500, and
• (c-1-1):
• being a compound in which a hydrogen atom of at least one hydroxyl group or carboxyl group of a compound shown by the following formula (I) is substituted with an acid-decomposable dissolution-inhibiting group:
• wherein each of R1, R2, R3, and R4 is independently a hydrogen atom, a straight- or branched chain, or cyclic alkyl group having 6 or less carbon atoms, a lower alkoxy group, a hydroxyl group, a carboxyl group, or an alkyl group containing a carboxyl group;
• X is a single bond, —C(O)—, or —C(R5)(R6)—, where R5 is a hydrogen atom or a lower alkyl group, and R6 is a hydrogen atom, a lower alkyl group, a carboxyl group, an alkyl group containing a carboxyl group, or an aryl group shown by the following formula (II);
• q is 0 or 1, and the group in a parenthesis in the formula (I) is a hydrogen atom when q is 0:
• wherein R1, R2, R3 and R4 have the same meanings as defined above.

A positive photoresist composition comprising:

• (A) a compound which generates an acid upon irradiation with radioactive ray,
• (B) an alkali-soluble novolak resin, and
• (C) a compound having at least one acid-decomposable dissolution-inhibiting group, said dissolution-inhibiting group being decomposable by action of an acid generated from said ingredient (A) to yield an organic carboxylic acid,
• wherein said ingredient (C) concurrently satisfies both the following conditions (c-1′) and (c-1-2).
• (c-1′):
• being a compound having a weight average molecular weight in a range from 100 to 1500, containing 1 to 6 substituted or unsubstituted benzene nuclei, and having at least one acid-decomposable dissolution-inhibiting group;
• and
• (c-1-2):
• being a compound which is a condensate of formaldehyde and at least one selected from the group consisting of phenol, m-cresol, p-cresol and xylenol, and at least one hydrogen atom of hydroxyl groups of said compound is substituted with a tert-butoxycarbonylalkyl group.

A positive photoresist composition comprising:

• (A) a compound which generates an acid upon irradiation with radioactive ray,
• (B) an alkali-soluble novolak resin, and
• (C) a compound having at least one acid-decomposable dissolution-inhibiting group, said dissolution-inhibiting group being decomposable by action of an acid generated from said ingredient (A) to yield an organic carboxylic acid,
• wherein said ingredient (C) satisfies the following condition (c-2):
• (c-2):
• being a polymer containing at least 2% by mole of a (meth)acrylic acid derivative unit having an acid-decomposable dissolution-inhibiting group and having a weight average molecular weight in a range from 2000 to 20000.