Copper foil excellent in laser beam drilling performance and production method therefor
AssigneeNikko Materials Co., Ltd.
InventorsKouji Kitano, Mikio Hanafusa
Life of this patent
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Abstract
A copper foil with excellent laser drilling property, having a layer containing any one or more substances selected from indium, tin, cobalt, zinc, cobalt alloys, and nickel alloys on the face of the copper foil to be radiated with laser beams. A copper foil easy to be laser-processed and suitable for forming through hole and via hole with a small diameter at the time of manufacturing a printed circuit board and a method for manufacturing such a copper foil are achieved by improving the surface of a copper foil.
Claims21
A perforated copper foil drilled by a laser beam, comprising:
- a copper foil having a thickness of 18 μm or less, a laser beam irradiation face onto which a laser beam is directed to perforate said copper foil, and an opposite face for being adhered to a resin substrate;
- and
- a layer located on said laser beam irradiation face of said copper foil for being perforated with said copper foil and containing at least one substance selected from a group consisting of indium, tin, cobalt, zinc, cobalt alloys, copper alloys, and nickel alloys;
- whereby said layer improves laser drilling processability of said copper foil.
A method for manufacturing a copper foil which has excellent laser drilling processability, comprising the steps of:
- obtaining a copper foil having a thickness of 18 μm or less, said copper foil having a laser beam irradiation face and an opposite face for being adhered to a resin substrate;
- forming a layer on said laser beam irradiation face of said copper foil, said layer containing at least one substance selected from a group consisting of indium, tin, cobalt, zinc, cobalt alloys, copper alloys, and nickel alloys;
- and
- perforating said copper foil and layer with a laser beam after said forming step.
Dependencies are inferred from the claim text.