US 6,638,638 B2 · Hollow solder structure having improved reliability and method of manufacturing same

Abstract

A solder structure comprising a radially-curved exterior surface enclosing a predetermined-sized cavity used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an annular conductive pad and the other planar element having either a corresponding annular or circular conductive pad, separated by a spherical solder compound comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.

Claims13

Dependent claims

A solder structure for electrically and mechanically connecting a first metal contact on a first planar surface to a second metal contact on a second planar surface, comprising:

a soldering means having a curved exterior surface enclosing a first volume;
and
an interior cavity constituting a second volume, wherein the second volume comprises not less than 1% and not more than 90% of the first volume.

Dependencies are inferred from the claim text.

Facts

Application

09/954,026Filed 18 Sep 2001

Published

US 2003/0052156 A120 Mar 2003

Granted

28 Oct 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification24 codes

H10W 72/20
Interconnections or connectors in packages: bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
B23K 1/0008
Soldering, e.g. brazing, or unsoldering: specially adapted for particular articles or work
B23K 35/0222
Characterised by mechanical features, e.g. shape: for use in soldering or brazing
H05K 1/111
Printed elements for providing electric connections to or between printed circuits: pads for surface mounting, e.g. lay-out

Hollow solder structure having improved reliability and method of manufacturing same

Life of this patent

Hollow solder structure having improved reliability and method of manufacturing same

Life of this patent

Abstract

Claims13