Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
AssigneeInternational Business Machines Corporation
InventorsBrian E. Curcio, Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock
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Abstract
A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
Claims9
An intermediate structure for a member for joining to at least one additional structure to form a composite structure comprising:
- a dielectric substrate having first and second opposite faces;
- a layer of adhesive tape overlying at least one face;
- at least one opening extending through said substrate and said adhesive tape, and
- a continuous electrically conductive material without longitudinal interface disposed in each of said openings.
Dependencies are inferred from the claim text.