Method and apparatus for plating substrate with copper
AssigneesEbara Corporation, Kabushiki Kaisha Toshiba
InventorsKoji Mishima, Mizuki Nagai, Ryoichi Kimizuka, Tetsuo Matsuda, Hisashi Kaneko
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Abstract
The present invention relates to a method and apparatus for separating out metal copper according to an electroplating of copper using, for example, a solution of copper sulfate to produce copper interconnections on a surface of a substrate. The substrate is brought into contact, at least once, with a processing solution containing at least one of organic substance and sulfur compound which are contained in a plating solution. Thereafter, the substrate is brought into contact with the plating solution to plate the substrate.
Claims13
A method of plating a substrate, comprising:
- bringing a substrate into contact with a processing solution comprising an organic substance which comprises a polyether organic polymer with a molecular weight in the range of 100 to 100,000 and has a concentration range of 10 mg/l to 10 g/l in the processing solution, wherein said bringing of the substrate into contact with the processing solution includes forming a layer of the organic substance on the substrate;
- and
- bringing the substrate into contact with a plating solution including the organic substance so as to plate the substrate, wherein the plating solution is different in composition form the processing solution.
An apparatus for plating a substrate, comprising:
- a processing device for bringing a substrate into contact with a processing solution comprising an organic substance which comprises a polyether organic polymer with a molecular weight in the range of 100 to 100,000 and has a concentration range of 10 mg/l to 10 g/l in the processing solution, wherein said processing device is operable to form a layer of said organic substance on the substrate by bringing the substrate into contact with said processing solution;
- and
- a plating device for bringing the substrate into contact with a plating solution including said organic substance so as to plate the substrate, wherein said plating solution is different in composition form said processing solution.
Dependencies are inferred from the claim text.