Method for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafers

A method of applying an insert to a chuck so that no air is trapped between the insert and the chuck, said method comprising the steps of:

• providing a tool for applying an insert to a chuck, said chuck having a plurality of holes and having a face, said tool comprising:
• a stamp disposed such that the stamp is capable of applying the insert to the face of the chuck, and said stamp being provided with at least one pin;
• a means for moving the stamp such that the stamp may apply the insert to the chuck;
• a vacuum chamber, wherein the chuck and the stamp may be disposed within the vacuum chamber;
• wherein each of the at least one pins is arranged to fit within corresponding holes in the chuck, whereby the position of the stamp relative to the chuck may be fixed when the stamp applies the insert to the chuck;
• providing an insert disposed on the stamp;
• thereafter providing a vacuum within the chamber;
• and
• thereafter applying, using the stamp, the insert to the chuck such that each of the at least one pins fits within corresponding holes in the chuck.